12a1 Wafer Hub Dicing iʻike i nā Blade Diacing Dicing no nā mea nānā holoi

12a1 Wafer Hub Dicing iʻike i nā pale o Diaming Dicing no nā mea iʻikeʻia i kiʻiʻia

Kākau pōkole:

Hoʻohanaʻia ka palaoa dicing blade no ke kauʻana,ʻokiʻoki i ka silicon wafer, compound semicondtors, nā aniani a me nā mea'ē aʻe a me nā mea'ē aʻe i nāʻenehana uila. Hoʻokomo pū kā mākou kāʻei lima i ka Diamond Hub e huki i kaʻili a me ka diamond Hubless Dicing. Hoʻokomoʻia nā mea paʻa i ka bond indin blade blade

Hoʻouna i ka leka uila iā mākou

Huahana kikoʻipiop

Nā Kūlana Huakaʻi

Ke noiʻana:ʻO ka laweʻana i ka paleʻana i ke aniani, Gallium Arsenade, GILLAMIMA BEBIE, EPOLOCK FEEMILL, ETC
Pehea e koho ai i nāʻano kūpono o nā mea e pale ai i nā pale eʻoki ai i nā mea?
* Binder of resin bondund
* Binder of College Bond (ikaika ikaika loa) Dicing Blade
* Binder of Electroplated Beast (Bonderand Bond)

Loaʻa i nā pono o Waer Hub Dicing iʻikeʻia
ʻO kaʻoki kiʻekiʻe kiʻekiʻe
ʻOi aku ka maikaʻi o ka blade kiʻekiʻe
Nā Hoʻolālā TICF KRF
Hoʻonuiʻia ke ola o ka Blade - Optimized no ka hana paʻa a me ka hana maʻamau.
Nā kiko'ī maʻamau - Loaʻa i nā mānoanoa'ē aʻe, nā'āpana, a me nā kinima a me nā kinipōpō e hoʻokūkū i nā noi kiko'ī.